Key data

CONNECTION TECHNOLOGY

Bonding

  • Adhesive stencil printing
  • Dispensers

Soldering

  • Full-tunnel double wave soldering under nitrogen
  • Reflow soldering under nitrogen
  • Selective soldering under nitrogen

Stencil printing

  • Stencil frames 585 x 585mm
  • Print area approx. 450 x 450mm
    (other sizes only after testing)

Coating

  • High speed coating, dam & fill, IR oven


COMPONENTS

Designs

  • Fitting of all conventional components
  • Special designs, labels
  • SMD chips from 0201
  • ICs up to 55mm
  • Pitch clearance up to 0.35mm
  • BGA


Programming

  • PROM, EPROM, EEPROM, FLASH
  • PALs, GALs, EPLDs, microcontrollers
  • Special component adaptor procurable upon request
  • Gear and set programmers
  • Programming with Sprint Optima


CIRCUIT BOARDS

Dimensions

  • Min. 100 x 135mm
  • Max. 450 x 450mm
  • Other sizes only after testing

OUR CAPACITY

  • 3-shift operation from Monday to Sunday
  • 10,000,000 SMD components per week
  • 2 SMD lines (Siplace)
  • Short-term capacity expansions possible


OUR QUALIFICATION

Certified according to:

  • DIN EN ISO 9001
  • DIN EN ISO 14001
  • DIN EN ISO 27001
  • EU Directive 2014/32/EU Annex D

 

 

Downloads

      Datasheets      

Flyer_Production_Rev2.pdf