Key data

CONNECTION TECHNOLOGY

Adhesion

  • Adhesion stencil printing
  • High speed dispensers

Soldering

  • Double wave soldering under nitrogen
  • Reflow soldering under nitrogen
  • Vapour phase soldering (for special cases)

Stencil printing

  • 585mm x 585mm stencil frame
  • Printing area approx. 400mm x 400mm

COMPONENTS

Processing of the following designs:

  • Assembly of all conventional designs
  • Special designs
  • SMD chips starting at 0402
  • ICs up to 55mm
  • Pitch spacing up to 0.4mm
  • BGA


Programming of all conventional circuits:

  • PROM, EPROM, EEPROM, FLASH
  • PALs, GALs, EPLDs, microcontrollers
  • Special component adaptors available upon request
  • Operation and set programmers
  • Programming with Sprint Expert, MQP S2000

CIRCUIT BOARDS

Dimensions:

  • min 50 x 50mm
  • max 460 x 460mm (X x Y)

OUR CAPACITY

3-shift operation from Monday to Sunday
3,000,000 SMD components per week
2 SMD lines (Siplace)
capacity can be increased by 25% in the short-term

OUR QUALIFICATIONS

Certified management system according to

  • DIN EN ISO 9001
  • DIN EN ISO 14001

Downloads

      Datasheets      

DB_Fertigung_1v3.pdf

  Presentation  

Vorstellung_Produktion-2011.pdf