Key Data of the production
CONNECTION TECHNOLOGY
Bonding
- Adhesive stencil printing
- Dispensers
Soldering
- Full-tunnel double wave soldering under nitrogen
- Reflow soldering under nitrogen
- Selective soldering under nitrogen
Stencil printing
- Stencil frames 585 x 585mm
- Print area approx. 450 x 450mm
(other sizes only after testing)
Coating
- High speed coating, dam & fill, IR oven
Control
- Highspeed 3D-AOI
COMPONENTS
Designs
- Fitting of all conventional components
- Special designs, labels
- SMD chips from 0201
- ICs up to 55mm
- Pitch clearance up to 0.35mm
- BGA
Programming
- PROM, EPROM, EEPROM, FLASH
- PALs, GALs, EPLDs, microcontrollers
- Special component adaptor procurable upon request
- Gear and set programmers
- Programming with Sprint Optima
CIRCUIT BOARDS
Dimensions
- Min. 100 x 135mm
- Max. 450 x 450mm
- Other sizes only after testing
OUR CAPACITY
- 3-shift operation from Monday to Sunday
- 10,000,000 SMD components per week
- 2 SMD lines (ASM Siplace)
- Short-term capacity expansions possible
OUR QUALIFICATION
Certified according to:
- DIN EN ISO 9001
- DIN EN ISO 14001
- DIN EN ISO 27001
- EU Directive 2014/32/EU Annex D
- Production according to IPC610 & 7711/7721
